We recently announced the arrival of the MediaTek Dimensity 8300 chipset and that the first smartphone with the chipset will be the Redmi K70E. The mobile phone, along with the other members of the Redmi K70 series, will debut sometime at the end of the month, but they have already started teasing it through teaser posters, and a few images have come to light recently.
The photos were published by Digital Chat Station, an Asian leaker with reliable information, on the Chinese social media site, Weibo. The first thing we can notice is that the display is surrounded by an ultra-thin bezel, which, according to official information, can have a maximum brightness of 1800 nits, PWM dimming of 1920 Hz, 12-bit color depth, and a resolution of 1.5K .
The latter could mean anything for the Chinese, as it will likely be in Full HD+. The display also includes a fingerprint reader. At the same time as the images are being published, Xiaomi’s campaign to promote the device is already underway, so we already know, for example, that a 5500 mAh battery will somehow be squeezed inside the Redmi K70E, which will support a 90W wired one. fast charging.
Despite the large battery size, the thickness of the phone will not exceed 8.05 mm. The Redmi K70E will therefore be powered by the MediaTek Dimensity 8300 chipset, which also has an Ultra variant, and this is the end of the series of officially confirmed specifications.
Thanks to rumors, we know that the K70E display will support a 120 Hz refresh rate, the panel will be 6.67 inches, LPDDR5X RAM modules will be installed in addition to the already mentioned MediaTek chipset, and there will be a configuration with 16 GB of operational memory.Memory is used. The internal storage will be UFS 4.0, and the Redmi K70E will be sold with 1TB of storage.
- to update: The phone will be launched on November 29.
source: GSMArena
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